140CPU65260 | Schneider | Magnetic field termination technology

Description

140CPU65260 | Schneider | Magnetic field termination technology

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At present, 140CPU65260  600V module adopts IGBT based on non penetrating (NPT) technology, and the produced wafers themselves form batches of IGBT. Compared to PT (penetration type) technology, NPT technology greatly improves the strength of the chip and reduces switching losses. The concept of NPT comes from Infineon, a very mature process used to process thin wafers. Infineon (the parent company of Eupec) is a multinational company that leads the world in technology. Therefore, although using thin-film technology, the 600VIGBT still uses Infineon’s magnetic field termination trench gate technology implemented on third-generation IGBT chips at 1200V and 1700V [1]. Is IGBT shown in Figure 3? And IGBT? Compare the structure of.

The development of the new 140CPU65260  600VIGBT technology provides optimized solutions for consumer products and industrial driven applications. The magnetic field termination layer allows for a reduction in chip thickness, reducing the charge stored in the IGBT, which makes it possible to reduce conduction voltage and switching losses. The strength and short-circuit resistance of the 600V IGBT3 chip fully meet the needs of industrial applications.
In summary, 140CPU65260  field termination technology combines the advantages of PT technology with thin active layer and NPT technology with well controlled back surface, resulting in reduced switching losses and improved chip strength. In addition, the maximum junction temperature is allowed to be high, allowing for higher extreme working conditions.
Eupec is now launching a new IGBT module, using the third-generation 600 V IGBT for the first time? Technology. This allows for a larger current range for each type of IGBT package, allowing for the use of the same design platform and power module size to design products with a wider power range, greatly reducing system costs. This avoids the need for redesigning new heat sinks, PCBs, and other components to design higher power products using larger packages

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