GE IS200TPROS1CBB IS230TSPRH1C MRP680538

Description

GE IS200TPROS1CBB IS230TSPRH1C MRP680538

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When heat flows down through the through-hole and reaches another layer, especially another copper layer, IS200TPROS1CBB IS230TSPRH1C MRP680538 will diffuse laterally into the material layer. Adding more and more through holes will ultimately reduce the effect, as the heat that diffuses laterally from one through hole to nearby materials will eventually meet the heat from another direction (originating from another through hole). The size of the ISL8240MEVAL4Z evaluation board is 3 inches x 4 inches. The top and bottom layers of the circuit board contain 2 ounces of copper, and the two inner layers each contain 2 ounces of copper. To make these copper layers work, the circuit board has 917 through holes with a diameter of 12 mils, all of which help to spread heat from the power module to the copper layer below.

To adapt to the increasing number of voltage tracks and higher performance microprocessors and FPGAs, IS200TPROS1CBB IS230TSPRH1C MRP680538 Advanced power management solutions such as ISL8240M power modules help improve efficiency by providing higher power density and lower power consumption. The optimal implementation of through holes in power module circuit board design has become an increasingly important factor in achieving higher power density.

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Mailbox：sauldcsplc@gmail.com | IS200TPROS1CBB IS230TSPRH1C MRP680538
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