KUKA KSD1-32 E93DA113I4B531

Description

KUKA KSD1-32 E93DA113I4B531

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There are many ways to solve EMI problems, and modern EMI suppression methods include: using EMI suppression coatings, selecting appropriate EMI suppression components, and EMI simulation design. Starting from the most basic PCB layout, this article discusses the role and design techniques of PCB layered stacking in controlling EMI radiation.
KUKA KSD1-32 E93DA113I4B531
power bus

Reasonably placing capacitors of appropriate capacity near the power pins of the IC can make the voltage jump of the IC output faster. However, the problem does not stop here. Due to the limited frequency response of capacitors, they are unable to generate the harmonic power required to drive the IC output cleanly across the entire frequency band. In addition, the transient voltage formed on the power bus will form a voltage drop at both ends of the inductance in the decoupling path, and these transient voltages are the main common mode EMI interference sources. How should we solve these problems?
KUKA KSD1-32 E93DA113I4B531
As for the ICs on our circuit board, The power layer around the IC can be regarded as an excellent high-frequency capacitor, which can collect the energy leaked by discrete capacitors that provide high-frequency energy for clean output. In addition, the inductance of a good power layer should be small, so that the transient signal synthesized by the inductance is also small, thereby reducing common mode EMI.

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