P026MX | FOXBORO | Measurement layout cable

Description

P026MX | FOXBORO | Measurement layout cable

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To P026MX  the average number of failures for a design, manufacturers will use a tool that supports critical area analysis, such as Mentor Graphics’ Calibre, and extract critical areas for each layer throughout the entire defect size range. To this end, manufacturers need to measure the layout and determine all areas where a given size of particle may cause a malfunction. Then, the tool needs to use mathematical integration methods to calculate the expected average number of faults using defect size and density data. The formula is:
Among them, P026MX  is the average number of failures; DMIN and DMAX are the minimum and maximum defect sizes in the existing defect data of this layer, respectively; And CA (X) and D (X) are the key areas and defect density data, respectively.

Once the P026MX calculates the average number of failures, they usually use one or more yield models to make a prediction of the yield of a design limited by defects. Due to the limitation of defect yield, the yield issue of those parameters cannot be considered. Therefore, special caution should be taken when attempting to correlate this value with the actual chip yield. One of the simplest and most commonly used yield models is the Poisson model: Y=E-ANF, where Y is yield, E is a constant, and ANF is the average number of failures. The calculation of the average number of faults and yield of cutting layers (such as contacts and through holes) is generally simpler than other layers.

Mailbox：sauldcsplc@gmail.com |P026MX
www.abbgedcs.com | Qiming Industrial Control | Simon +86 13822101417

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